FAMIC Series “High precision chip bonder”
High precision mounting device of a vacuum suctioned chip
Features
Optical element mounting device
FAMIC-5R
Offering high precision mounting of a vacuumed chip by the inverted optical system
Full automatic microchip bonder
FAMIC-5
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.
Full automatic microchip bonder
FAMIC-3
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.
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