Japanese

FAMIC Series  “High precision chip bonder”

High precision mounting device of a vacuum suctioned chip

Features

Optical element mounting device

FAMIC-5R

Offering high precision mounting of a vacuumed chip by the inverted optical system

High-power LD chip bonder

FAMIC-5M

Offering high precision positioning at one side face of a chip

Full automatic microchip bonder

FAMIC-5

Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.

Full automatic microchip bonder

FAMIC-3

Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.